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Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints
- Pinardi, K. (author)
-
- Lai, Zonghe, 1948 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- Kang, Yi Lan (author)
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- (creator_code:org_t)
- 2000
- 2000
- English.
- In: ECTC 50th. ; , s. 1118-1121
- Conference paper (peer-reviewed)
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Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
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- Pinardi, K.
- Lai, Zonghe, 194 ...
- Kang, Yi Lan
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- ENGINEERING AND TECHNOLOGY
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- ECTC 50th
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- Chalmers University of Technology
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